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april 2011 doc id 5067 rev 17 1/38 1 m24c16-x m24c08-x m24c04-x m24c02-x m24c01-x 16 kbit, 8 kbit, 4 kbit, 2 kbit and 1 kbit serial i2c bus eeprom features supports both the 100 khz i 2 c standard-mode and the 400 khz i 2 c fast-mode single supply voltage: ? 2.5 v to 5.5 v for m24cxx-w ? 1.8 v to 5.5 v for m24cxx ? 1.7 v to 5.5 v for m24cxx-f write control input byte and page write (up to 16 bytes) random and sequential read modes self-timed programming cycle automatic address incrementing enhanced esd/latch-up protection more than 1 million write cycles more than 40-year data retention packages: ? so8, tssop8, ufdfpn8: ecopack2 ? (rohs-compliant and halogen-free) ? pdip8: ecopack1 ? (rohs-compliant) 1. only m24c08-f and m24c16-f devices are offered in the wlcsp package. 2. only m24c08-f devices are offered in the thin wlcsp package. table 1. device summary reference part number m24c16-x m24c16-w m24c16-r m24c16-f m24c08-x m24c08-w m24c08-r m24c08-f m24c04-x m24c04-w m24c04-r m24c04-f m24c02-x m24c02-w m24c02-r m24c01-x m24c01-w m24c01-r pdip8 (bn) so8 (mn) 150 mils width tssop8 (dw) 169 mils width ufdfpn8 (mb, mc) 2 3 mm (mlp) wlcsp (cs) (1) thin wlcsp (ct) (2) www.st.com
contents m24c16, m24c08, m24c04, m24c02, m24c01 2/38 doc id 5067 rev 17 contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 serial clock (scl) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 serial data (sda) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 chip enable (e0, e1, e2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3.1 write control (wc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 supply voltage (v cc ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4.1 operating supply voltage v cc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4.2 power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4.3 device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.4.4 power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2 stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3 acknowledge bit (ack) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4 data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.5 memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.6 write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6.1 byte write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.6.2 page write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.6.3 minimizing system delays by polling on ack . . . . . . . . . . . . . . . . . . . . . 16 3.7 read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.7.1 random address read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.7.2 current address read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.7.3 sequential read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.7.4 acknowledge in read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4 initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 dc and ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
m24c16, m24c08, m24c04, m24c02, m24c01 contents doc id 5067 rev 17 3/38 7 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
list of tables m24c16, m24c08, m24c04, m24c02, m24c01 4/38 doc id 5067 rev 17 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 4. operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 5. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 6. operating conditions (m24cxx-w) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 0 table 7. operating conditions (m24cxx-r) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 0 table 8. operating conditions (m24cxx-f) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 9. dc characteristics (m24cxx-w, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 10. dc characteristics (m24cxx-w, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 11. dc characteristics (m24cxx-r) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 12. dc characteristics (m24cxx-f). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 13. ac measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 14. input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 15. ac characteristics at 400 khz (i 2 c fast-mode) (m24cxx-w, m24cxx-r, m24cxx-f) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 16. ac characteristics at 100 khz (i 2 c standard-mode) (m24cxx-w, m24cxx-r, m24cxx-f) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 17. m24c08: wlcsp (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 27 table 18. m24c08: thin wlcsp (0.3 mm height), 0.4 mm pitch, 5 bumps, package data . . . . . . . . 28 table 19. m24c16: wlcsp (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . . . . . . . . . . . . 28 table 20. so8 narrow ? 8 lead plastic small outline, 150 mils body width, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 21. ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 22. tssop8 ? 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 31 table 23. pdip8 ? 8 pin plastic dip, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 32 table 24. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 25. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
m24c16, m24c08, m24c04, m24c02, m24c01 list of figures doc id 5067 rev 17 5/38 list of figures figure 1. logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2. 8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3. wlcsp and thin wlcsp connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 4. device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 5. maximum r p value versus bus parasitic capacitance (c) for an i2c bus . . . . . . . . . . . . . . 9 figure 6. i2c bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 7. write mode sequences with wc = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 8. write mode sequences with wc = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 9. write cycle polling flowchart using ack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 figure 10. read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 11. ac measurement i/o waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 figure 12. ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 figure 13. wlcsp (0.5 mm) and thin wlcsp (0.3 mm) 0.4 mm pitch 5 bumps, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 figure 14. so8 narrow ? 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 29 figure 15. ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 16. tssop8 ? 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31 figure 17. pdip8 ? 8 pin plastic dip, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 32
description m24c16, m24c08, m24c04, m24c02, m24c01 6/38 doc id 5067 rev 17 1 description these i2c-compatible electric ally erasable programmable memory (eeprom) devices are organized as 2048/1024/512/256/128 x 8 (m24c16, m24c08, m24c04, m24c02 and m24c01). figure 1. logic diagram i2c uses a two-wire serial interface, comprising a bidirectional data line and a clock line. the devices carry a built-in 4-bit device type identifier code (1010) in accordance with the i2c bus definition. the device behaves as a slave in the i2c protocol, with all memory operations synchronized by the serial clock. read and write operations are initiated by a start condition, generated by the bus master. the start condition is followed by a device select code and read/ write bit (r w ) (as described in ta bl e 3 ), terminated by an acknowledge bit. when writing data to the memory, the device inserts an acknowledge bit during the 9 th bit time, following the bus master?s 8-bit transmission. when data is read by the bus master, the bus master acknowledges the receipt of the data byte in the same way. data transfers are terminated by a stop condition after an ack for write, and after a noack for read. table 2. signal names signal name function direction e0, e1, e2 chip enable input sda serial data input/output scl serial clock input wc write control input v cc supply voltage v ss ground ai02033 3 e0-e2 sda v cc m24cxx wc scl v ss
m24c16, m24c08, m24c04, m24c02, m24c01 description doc id 5067 rev 17 7/38 figure 2. 8-pin package connections (top view) 1. nc = not connected 2. see section 7: package mechanical data for package dimensions, and how to identify pin-1. 3. the ei inputs are not decoded, and are therefore decoded as ?0? (see section 2.3: chip enable (e0, e1, e2) for more information). figure 3. wlcsp and thin wlcsp connections (top view, marking side, with balls on the underside) 1. for devices of less than 16kb (see figure 2: 8-pin package connections (top view) ), the ei inputs are not connected to a ball, therefore the ei input is decoded as "0" (see also section 2.3: chip enable (e0, e1, e2) ) caution: eeprom dice delivered in wafer form or in wlcsp package by stmicroelectronics must never be exposed to ultra violet (uv) light, since eeprom cells loose their charge (and so their binary value) when exposed to uv light. s da v ss s cl wc v cc ai020 3 4f m24cxx 1 2 3 4 8 7 6 5 16k b / 8 k b / 4k b / 2k b / 1k b nc / nc / nc / e0 / e0 nc / nc / e1 / e1 / e1 nc / e2 / e2 / e2 / e2 v cc wc sda scl v ss ai14908
signal description m24c16, m24c08, m24c04, m24c02, m24c01 8/38 doc id 5067 rev 17 2 signal description 2.1 serial clock (scl) this input signal is used to strobe all data in and out of the device. in applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor can be connected from serial clock (scl) to v cc . ( figure 5 indicates how the value of the pull-up resistor can be calculated). in most applications, though, this method of sy nchronization is not employed, and so the pull- up resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output. 2.2 serial data (sda) this bidirectional signal is used to transfer data in or out of the device. it is an open drain output that may be wire-ored with other open drain or open collector signals on the bus. a pull up resistor must be connected from serial data (sda) to v cc . ( figure 5 indicates how the value of the pull-up resistor can be calculated). 2.3 chip enable (e0, e1, e2) these input signals are used to set the value that is to be looked for on the least significant bits of the 7-bit device select code. these inputs must be tied to v cc or v ss , to establish the device select code as shown in figure 4 . when not connected (left floating), ei inputs are read as low (0). figure 4. device select code 2.3.1 write control (wc ) this input signal is useful for protecting the entire contents of the memory from inadvertent write operations. write operations are disabled to the entire memory array when write control ( wc ) is driven high. when unconnected, the signal is internally read as v il , and write operations are allowed. when write control ( wc ) is driven high, device select and address bytes are acknowledged, data bytes are not acknowledged. ai11650 v cc m24cxx v ss e i v cc m24cxx v ss e i
m24c16, m24c08, m24c04, m24c02, m24c01 signal description doc id 5067 rev 17 9/38 2.4 supply voltage (v cc ) 2.4.1 operating supply voltage v cc prior to selecting the memory and issuing instructions to it, a valid and stable v cc voltage within the specified [v cc (min), v cc (max)] range must be applied (see ta bl e 6 , ta bl e 7 and ta bl e 8 ). in order to secure a stable dc supply voltage, it is recommended to decouple the v cc line with a suitable capacitor (usually of the order of 10 nf to 100 nf) close to the v cc /v ss package pins. this voltage must remain stable and valid until the end of the transmission of the instruction and, for a write instruction, until the completion of the internal write cycle (t w ). 2.4.2 power-up conditions the v cc voltage has to rise continuously from 0 v up to the minimum v cc operating voltage defined in ta bl e 6 , ta bl e 7 and ta b l e 8 and the rise time must not vary faster than 1 v/s. 2.4.3 device reset in order to prevent inadvertent write operations during power-up, a power-on-reset (por) circuit is included. at power-up (continuous rise of v cc ), the device does not respond to any instruction until v cc reaches the power-on-reset threshold voltage (this threshold is lower than the minimum v cc operating voltage defined in ta b l e 6 , ta b l e 7 and ta b l e 8 ). when v cc passes over the por threshold, the device is reset and enters the standby power mode. the device, however, must not be accessed until v cc reaches a valid and stable v cc voltage within the specified [v cc (min), v cc (max)] range. in a similar way, during power-down (continuous decrease in v cc ), as soon as v cc drops below the power-on-reset threshold voltage, the device stops responding to any instruction sent to it. 2.4.4 power-down conditions during power-down (continuous decrease in v cc ), the device must be in the standby power mode (mode reached after decoding a stop cond ition, assuming that there is no internal write cycle in progress). figure 5. maximum r p value versus bus parasitic capacitance (c) for an i2c bus 1 10 100 10 100 1000 b us line c a p a citor (pf) b us line p u ll- u p re s i s tor (k ) when t low = 1. 3 s (min v a l u e for f c = 400 khz), the r bus c bus time con s t a nt m us t b e b elow the 400 n s time con s t a nt line repre s ented on the left. i2c bus m as ter m24xxx r bus v cc c bus s cl s da a i14796 b r bus c bus = 400 n s here r bus c bus = 120 n s 4 k 3 0 pf
signal description m24c16, m24c08, m24c04, m24c02, m24c01 10/38 doc id 5067 rev 17 figure 6. i2c bus protocol table 3. device select code device type identifier (1) 1. the most significant bit, b7, is sent first. chip enable (2),(3) 2. e0, e1 and e2 are compared against the respec tive external pins on the memory device. 3. a10, a9 and a8 represent most significant bits of the address. rw b7 b6 b5 b4 b3 b2 b1 b0 m24c01 select code 1 0 1 0 e2 e1 e0 rw m24c02 select code 1 0 1 0 e2 e1 e0 rw m24c04 select code 1 0 1 0 e2 e1 a8 rw m24c08 select code 1 0 1 0 e2 a9 a8 rw m24c16 select code 1 0 1 0 a10 a9 a8 rw scl sda scl sda sda start condition sda input sda change ai00792c stop condition 1 23 7 89 msb ack start condition scl 1 23 7 89 msb ack stop condition
m24c16, m24c08, m24c04, m24c02, m24c01 device operation doc id 5067 rev 17 11/38 3 device operation the device supports the i2c protocol. this is summarized in figure 6 . any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. the device that controls the data transfer is known as the bus master, and the other as the slave device. a data transfer can on ly be initiated by the bus master, which will also provide the serial clock for synchronization. the device is always a slave in all communication. 3.1 start condition start is identified by a falling edge of serial da ta (sda) while serial clock (scl) is stable in the high state. a start condition must precede any data transfer command. the device continuously monitors (except during a write cycle) serial data (sda) and serial clock (scl) for a start condition. 3.2 stop condition stop is identified by a rising edge of serial data (sda) while serial clock (scl) is stable and driven high. a stop condition terminates communication between the device and the bus master. a read command that is followed by noack can be followed by a stop condition to force the device into the standby mode. a stop condition at the end of a write command triggers the internal write cycle. 3.3 acknowledge bit (ack) the acknowledge bit is used to indicate a successful byte transfer. the bus transmitter, whether it be bus master or slave device, releases serial data (sda) after sending eight bits of data. during the 9 th clock pulse period, the receiver pulls serial data (sda) low to acknowledge the receipt of the eight data bits. 3.4 data input during data input, the device samples serial data (sda) on the rising edge of serial clock (scl). for correct device operation, serial data (sda) must be stable during the rising edge of serial clock (scl), and the serial data (sda) signal must change only when serial clock (scl) is driven low.
device operation m24c16, m24c08, m24c04, m24c02, m24c01 12/38 doc id 5067 rev 17 3.5 memory addressing to start communication between the bus master and the slave device, the bus master must initiate a start condition. follo wing this, the bus master sends the device select code, shown in ta b l e 3 (on serial data (sda), most significant bit first). the device select code consists of a 4-bit device type identifier, and a 3-bit chip enable ?address? (e2, e1, e0). to address the memory array, the 4-bit device type identifier is 1010b. each device is given a unique 3-bit code on the chip enable (e0, e1, e2) inputs. when the device select code is received , the device only responds if the chip enable address is the same as the value on the chip enable (e0, e1, e2) inputs. however, those devices with larger memory capacities (the m24c16, m24c08 and m24c04) need more address bits. e0 is not available for use on devices that need to use address line a8; e1 is not available for devices that need to use address line a9, and e2 is not available for devices that need to use address line a10 (see figure 2 and ta b l e 3 for details). using the e0, e1 and e2 inputs, up to eight m24c02 (or m24c01), four m24c04, two m24c08 or one m24c16 devices can be connected to one i2c bus. in each case, and in the hybrid cases, this gives a total memory capacity of 16 kbits, 2 kbytes (except where m24c01 devices are used). the 8 th bit is the read/ write bit (r w ). this bit is set to 1 for read and 0 for write operations. if a match occurs on the device select code, the corresponding device gives an acknowledgment on serial data (sda) during the 9 th bit time. if the device does not match the device select code, it deselects itself from the bus, and goes into standby mode. table 4. operating modes mode rw bit wc (1) 1. x = v ih or v il . bytes initial sequence current address read 1 x 1 start, device select, rw = 1 random address read 0x 1 start, device select, rw = 0, address 1 x restart, device select, rw = 1 sequential read 1 x 1 similar to current or random address read byte write 0 v il 1 start, device select, rw = 0 page write 0 v il 16 start, device select, rw = 0
m24c16, m24c08, m24c04, m24c02, m24c01 device operation doc id 5067 rev 17 13/38 figure 7. write mode sequences with wc = 1 (data write inhibited) 3.6 write operations following a start condition the bus master sends a device select code with the read/ write bit (r w ) reset to 0. the device acknowledges this, as shown in figure 8 , and waits for an address byte. the device responds to the address byte with an acknowledge bit, and then waits for the data byte. when the bus master generates a stop condition immediately after a data byte ack bit (in the ?10 th bit? time slot), either at the end of a byte write or a page write, the internal write cycle is triggered. a stop condition at any other time slot does not trigger the internal write cycle. after the stop condition, the t w delay, and the successful completion of a write operation, the device internal address counter is automatically incremented, to point to the next byte address after the last one that was modified. during the internal write cycle, serial data (sda) is disabled internally, and the device does not respond to any request. if the write control (wc) input is driven high, the write instruction is not executed and the corresponding data bytes are not acknowledged as shown in figure 7 . stop start byte write dev select byte address data in wc start page write dev select byte address data in 1 data in 2 wc data in 3 ai02803d page write (cont'd) wc (cont'd) stop data in n ack ack no ack r/w ack ack no ack no ack r/w no ack no ack
device operation m24c16, m24c08, m24c04, m24c02, m24c01 14/38 doc id 5067 rev 17 3.6.1 byte write after the device select code and the address byte, the bus master sends one data byte. if the addressed location is write-protected, by write control ( wc ) being driven high, the device replies to the data byte with noack, as shown in figure 7 , and the location is not modified. if, instead, the addressed location is not write-protected, the device replies with ack. the bus master terminates the transfer by generating a stop condition, as shown in figure 8 . 3.6.2 page write the page write mode allows up to 16 bytes to be written in a single write cycle, provided that they are all located in the same page in the memory: that is, the most significant memory address bits are the same. if more byte s are sent than will fit up to the end of the page, a condition known as ?roll-over? occurs. this should be avoided, as data starts to become overwritten in an implementation dependent way. the bus master sends from 1 to 16 bytes of data, each of which is acknowledged by the device if write control ( wc ) is low. if the addressed location is write-protected, by write control ( wc ) being driven high, the device replies to the data bytes with noack, as shown in figure 7 , and the locations are not modified. after each byte is transferred, the internal byte address counter (the 4 least significant address bits only) is incremented. the transfer is terminated by the bus master generating a stop condition.
m24c16, m24c08, m24c04, m24c02, m24c01 device operation doc id 5067 rev 17 15/38 figure 8. write mode sequences with wc = 0 (data write enabled) stop start byte write dev select byte address data in wc start page write dev select byte address data in 1 data in 2 wc data in 3 ai02804c page write (cont'd) wc (cont'd) stop data in n ack r/w ack ack ack ack ack ack r/w ack ack
device operation m24c16, m24c08, m24c04, m24c02, m24c01 16/38 doc id 5067 rev 17 figure 9. write cycle polling flowchart using ack 3.6.3 minimizing system delays by polling on ack during the internal write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells. the maximum write time (t w ) is shown in ta b l e 15 , but the typical time is shorter. to make use of this, a polling sequence can be used by the bus master. the sequence, as shown in figure 9 , is: initial condition: a write cycle is in progress. step 1: the bus master issues a start condition followed by a device select code (the first byte of the new instruction). step 2: if the device is busy with the inte rnal write cycle, no ack will be returned and the bus master goes back to step 1. if the device has terminated the internal write cycle, it responds with an ack, indicating that the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during step 1). write cycle in progress ai01847d next operation is addressing the memory start condition device select with rw = 0 ack returned yes no yes no restart stop data for the write operation device select with rw = 1 send address and receive ack first byte of instruction with rw = 0 already decoded by the device yes no start condition continue the write operation continue the random read operation
m24c16, m24c08, m24c04, m24c02, m24c01 device operation doc id 5067 rev 17 17/38 figure 10. read mode sequences 1. the seven most significant bits of the dev ice select code of a random read (in the 1 st and 3 rd bytes) must be identical. 3.7 read operations read operations are performed independently of the state of the write control ( wc ) signal. the device has an internal address counter which is incremented each time a byte is read. 3.7.1 random address read a dummy write is first performed to load the address into this address counter (as shown in figure 10 ) but without sending a stop condition. then, the bus master sends another start condition, and repeats the device select code, with the read/ write bit (r w ) set to 1. the device acknowledges this, and outputs the contents of the addressed byte. the bus master must not acknowledge the byte, and terminates the transfer with a stop condition. start dev select * byte address start dev select data out 1 ai01942b data out n stop start current address read dev select data out random address read stop start dev select * data out sequentila current read stop data out n start dev select * byte address sequential random read start dev select * data out 1 stop ack r/w no ack ack r/w ack ack r/w ack ack ack no ack r/w no ack ack ack r/w ack ack r/w ack no ack
device operation m24c16, m24c08, m24c04, m24c02, m24c01 18/38 doc id 5067 rev 17 3.7.2 current address read for the current address read operation, following a start condition, the bus master only sends a device select code with the read/ write bit (r w ) set to 1. the device acknowledges this, and outputs the byte addressed by the internal address counter. the counter is then incremented. the bus master terminates the transfer with a stop condition , as shown in figure 10 , without acknowledging the byte. 3.7.3 sequential read this operation can be used after a current address read or a random address read. the bus master does acknowledge the data byte output, and sends additional clock pulses so that the device continues to output the next byte in sequence. to terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a stop condition, as shown in figure 10 . the output data comes from consecutive addresses, with the internal address counter automatically incremented after each byte output. after the last memory address, the address counter ?rolls-over?, and the device continues to output data from memory address 00h. 3.7.4 acknowledg e in read mode for all read commands, the device waits, after each byte read, for an acknowledgment during the 9 th bit time. if the bus master does not drive serial data (sda) low during this time, the device terminates the data transfer and switches to its standby mode.
m24c16, m24c08, m24c04, m24c02, m24c01 initial delivery state doc id 5067 rev 17 19/38 4 initial delivery state the device is delivered with all bits in the memory array set to 1 (each byte contains ffh). 5 maximum rating stressing the device outside the ratings listed in ta bl e 5 may cause permanent damage to the device. these are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operat ing sections of this specification, is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. refer also to the stmicroe lectronics sure program and other relevant quality documents. table 5. absolute maximum ratings symbol parameter min. max. unit ambient operating temperature ?40 130 c t stg storage temperature ?65 150 c t lead lead temperature during soldering see note (1) 1. compliant with jedec std j-std-020c (for smal l body, sn-pb or pb assembly), the st ecopack ? 7191395 specification, and the european directive on re strictions on hazardous substances (rohs) 2002/95/eu. c pdip-specific lead temperature during soldering - 260 (2) 2. t lead max must not be applied for more than 10 s. c i ol dc output current (sda = 0) - 5 ma v io input or output range ?0.50 6.5 v v cc supply voltage ?0.50 6.5 v v esd electrostatic discharge voltage (human body model) (3) 3. aec-q100-002 (compliant wi th jedec std jesd22-a114, c1 = 100 pf, r1 = 1500 , r2 = 500 ). - 4000 v
dc and ac parameters m24c16, m24c08, m24c04, m24c02, m24c01 20/38 doc id 5067 rev 17 6 dc and ac parameters this section summarizes the operating and measurement conditions, and the dc and ac characteristics of the device. the parameters in the dc and ac characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. table 6. operating conditions (m24cxx-w) symbol parameter min. max. unit v cc supply voltage 2.5 5.5 v ambient operating temperature (device grade 6) ?40 85 c ambient operating temperature (device grade 3) ?40 125 c table 7. operating conditions (m24cxx-r) symbol parameter min. max. unit v cc supply voltage 1.8 5.5 v ambient operating temperature ?40 85 c table 8. operating conditions (m24cxx-f) symbol parameter min. max. unit v cc supply voltage 1.7 5.5 v ambient operating temperature ?20 85 c
m24c16, m24c08, m24c04, m24c02, m24c01 dc and ac parameters doc id 5067 rev 17 21/38 table 9. dc characteristics (m24cxx-w, device grade 6) symbol parameter test conditions (in addition to those in table 6 ) min. max. unit i li input leakage current (scl, sda, e0, e1,and e2) v in = v ss or v cc , device in standby mode - 2 a i lo output leakage current sda in hi-z, external voltage applied on sda: v ss or v cc - 2a i cc supply current v cc = 5 v, f c = 400 khz (rise/fall time < 50 ns) -2ma v cc = 2.5 v, f c = 400 khz (rise/fall time < 50 ns) -1ma i cc1 standby supply current device not selected (1) , v in = v ss or v cc , for 2.5 v < v cc 5.5 v 1. the device is not selected after a power-up, after a read command (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write command). -1a v il input low voltage (sda, scl, wc ) ?0.45 0.3v cc v v ih input high voltage (sda, scl, wc ) 0.7v cc v cc +1 v v ol output low voltage i ol = 2.1 ma when v cc = 2.5 v or i ol = 3 ma when v cc = 5.5 v -0.4v table 10. dc characteristics (m24cxx-w, device grade 3) symbol parameter test condition (in addition to those in table 6 ) min. max. unit i li input leakage current (scl, sda, e0, e1,and e2) v in = v ss or v cc , device in standby mode - 2a i lo output leakage current sda in hi-z, external voltage applied on sda: v ss or v cc - 2a i cc supply current v cc = 5 v, f c = 400 khz (rise/fall time < 50 ns) -3ma v cc = 2.5 v, f c = 400 khz (rise/fall time < 50 ns) -3ma i cc1 standby supply current device not selected (1) , v in = v ss or v cc , v cc = 5 v 1. the device is not selected after a power-up, after a read command (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write command). -5a device not selected (1) , v in = v ss or v cc , v cc = 2.5 v -2a v il input low voltage (sda, scl, wc ) ?0.45 0.3v cc v v ih input high voltage (sda, scl, wc ) 0.7v cc v cc +1 v v ol output low voltage i ol = 2.1 ma when v cc = 2.5 v or i ol = 3 ma when v cc = 5.5 v -0.4v
dc and ac parameters m24c16, m24c08, m24c04, m24c02, m24c01 22/38 doc id 5067 rev 17 table 11. dc characteristics (m24cxx-r) symbol parameter test condition (in addition to those in table 7 ) min. max. unit i li input leakage current (scl, sda, e0, e1,and e2) v in = v ss or v cc , device in standby mode - 2a i lo output leakage current sda in hi-z, external voltage applied on sda: v ss or v cc - 2a i cc supply current v cc = 1.8 v, f c = 400 khz (rise/fall time < 50 ns) -0.8ma i cc1 standby supply current device not selected (1) , v in = v ss or v cc , v cc = 1.8 v 1. the device is not selected after a power-up, after a read command (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write command). -1a v il input low voltage (sda, scl, wc ) 2.5 v v cc ?0.45 0.3 v cc v 1.8 v v cc < 2.5 v ?0.45 0.25 v cc v v ih input high voltage (sda, scl, wc ) 0.7v cc v cc +1 v v ol output low voltage i ol = 0.7 ma, v cc = 1.8 v - 0.2 v
m24c16, m24c08, m24c04, m24c02, m24c01 dc and ac parameters doc id 5067 rev 17 23/38 figure 11. ac measurement i/o waveform table 12. dc characteristics (m24cxx-f) symbol parameter test condition (in addition to those in table 8 ) min. max. unit i li input leakage current (scl, sda, e0, e1,and e2) v in = v ss or v cc , device in standby mode - 2 a i lo output leakage current v out = v ss or v cc, sda in hi-z - 2 a i cc supply current v cc = 1.7 v, f c = 400 khz (rise/fall time < 50 ns) -0.8ma i cc1 standby supply current device not selected (1) , v in = v ss or v cc , v cc = 1.7 v -1a v il input low voltage (sda, scl, wc ) 2.5 v v cc ?0.45 0.3 v cc v 1.7 v v cc < 2.5 v ?0.45 0.25 v cc v v ih input high voltage (sda, scl, wc )0.7v cc v cc +1 v v ol output low voltage i ol = 0.7 ma, v cc = 1.7 v - 0.2 v 1. the device is not selected after a power-up, after a read co mmand (after the stop condition), or after the completion of the internal write cycle t w (t w is triggered by the correct decoding of a write command). table 13. ac measurement conditions symbol parameter min. max. unit c bus load capacitance 100 pf scl input rise/fall time, sda input fall time - 50 ns input levels 0.2v cc to 0.8v cc v input and output timing reference levels 0.3v cc to 0.7v cc v ai00825b 0.8v cc 0.2v cc 0.7v cc 0.3v cc input and output timing reference levels input levels table 14. input parameters symbol parameter (1) test condition min. max. unit c in input capacitance (sda) - 8 pf c in input capacitance (other pins) - 6 pf z wcl wc input impedance v in < 0.3 v 15 70 k z wch wc input impedance v in > 0.7v cc 500 - k t ns pulse width ignored (input filter on scl and sda) single glitch - 100 ns 1. characterized only.
dc and ac parameters m24c16, m24c08, m24c04, m24c02, m24c01 24/38 doc id 5067 rev 17 table 15. ac characteristics at 400 khz (i 2 c fast-mode) (m24cxx-w, m24cxx-r, m24cxx-f) test conditions specified in either table 6 , table 7 or table 8 and table 13 symbol alt. parameter min. (1) 1. all values are referred to v il (max) and v ih (min). max. (1) unit f c f scl clock frequency - 400 khz t chcl t high clock pulse width high 600 - ns t clch t low clock pulse width low 1300 - ns t ql1ql2 (2) 2. characterized only, not tested in production. t f sda (out) fall time 20 (3) 3. with c l = 10 pf. 120 ns t xh1xh2 t r input signal rise time (4) 4. there is no min. or max. values for the input signal rise and fall times. it is however recommended by the i2c specification that the input signal rise and fa ll times be more than 20 ns and less than 300 ns when f c < 400 khz. (4) ns t xl1xl2 t f input signal fall time (4) (4) ns t dxcx t su:dat data in set up time 100 - ns t cldx t hd:dat data in hold time 0 - ns t clqx t dh data out hold time 100 - ns t clqv (5)(6) 5. to avoid spurious start and stop conditions, a minimum delay is plac ed between scl=1 and the falling or rising edge of sda. 6. t clqv is the time (from the falling edge of scl) r equired by the sda bus line to reach either 0.3v cc or 0.7v cc , assuming that r bus c bus time constant is within the values specified in figure 5 . t aa clock low to next data valid (access time) 200 900 ns t chdl t su:sta start condition setup time 600 - ns t dlcl t hd:sta start condition hold time 600 - ns t chdh t su:sto stop condition set up time 600 - ns t dhdl t buf time between stop condition and next start condition 1300 - ns t w t wr write time - 5 ms
m24c16, m24c08, m24c04, m24c02, m24c01 dc and ac parameters doc id 5067 rev 17 25/38 table 16. ac characteristics at 100 khz (i 2 c standard-mode) (1) (m24cxx-w, m24cxx-r, m24cxx-f) 1. values recommended by the i 2 c bus standard-mode specification for a robust design of the i 2 c bus application. note that the m24xxx devices dec ode correctly faster timi ngs as specified in table 15: ac characteristics at 400 khz (i2c fast-m ode) (m24cxx-w, m24cxx-r, m24cxx-f) . test conditions specified in either table 6 , table 7 or table 8 and table 13 symbol alt. parameter min. max. unit f c f scl clock frequency - 100 khz t chcl t high clock pulse width high 4 - s t clch t low clock pulse width low 4.7 - s t xh1xh2 t r input signal rise time - 1 s t xl1xl2 t f input signal fall time - 300 ns t ql1ql2 (2) 2. characterized only. t f sda fall time - 300 ns t dxcx t su:dat data in setup time 250 - ns t cldx t hd:dat data in hold time 0 - ns t clqx t dh data out hold time 200 - ns t clqv (3) 3. to avoid spurious start and stop conditions, a minimum delay is plac ed between scl=1 and the falling or rising edge of sda. t aa clock low to next data valid (access time) 200 3450 ns t chdx (4) 4. for a restart condition, or following a write cycle. t su:sta start condition setup time 4.7 - s t dlcl t hd:sta start condition hold time 4 - s t chdh t su:sto stop condition setup time 4 - s t dhdl t buf time between stop condition and next start condition 4.7 - s t w t wr write time - 5 ms
dc and ac parameters m24c16, m24c08, m24c04, m24c02, m24c01 26/38 doc id 5067 rev 17 figure 12. ac waveforms 3#, 3$!)n 3#, 3$!/ut 3#, 3$!)n t#(#, t$,#, t#($, 3tart condition t#,#( t$8#( t#,$8 3$! )nput 3$! #hange t#($( t$($, 3top condition $atavalid t#,16 t#,18 t#($( 3top condition t#($, 3tart condition 7ritecycle t7 !)f 3tart condition t#(#, t8(8( t8(8( t8,8, t8,8, $atavalid t1,1,
m24c16, m24c08, m24c04, m24c02, m24c01 package mechanical data doc id 5067 rev 17 27/38 7 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. wlcsp (0.5 mm) and thin wlcsp (0.3 mm) 0.4 mm pitch 5 bumps, package outline 1. drawing is not to scale. table 17. m24c08: wlcsp (0.5 mm height) 0.4 mm pitch, 5 bumps, package data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to 4 decimal digits. typ min max typ min max a 0.545 0.495 0.595 0.0215 0.0195 0.0234 a1 0.190 0.165 0.215 0.0075 0.0065 0.0085 a2 0.355 0.330 0.380 0.0140 0.0130 0.0150 b 0.270 0.240 0.300 0.0106 0.0094 0.0118 d 1.215 1.195 1.235 0.0478 0.0470 0.0486 e 1.025 1.005 1.045 0.0404 0.0396 0.0411 e 0.400 - - 0.0157 - - e1 0.693 - - 0.0273 - - e2 0.346 - - 0.0136 - - f 0.313 - - 0.0123 - - g 0.261 - - 0.0103 - - n (2) 2. n is the total number of terminals. 55 orient a tion reference e a b c d e1 e2 e f g a a2 a1 s eating plane 12 3 1c a _me b
package mechanical data m24c16, m24c08, m24c04, m24c02, m24c01 28/38 doc id 5067 rev 17 table 18. m24c08: thin wlcsp (0.3 mm hei ght), 0.4 mm pitch, 5 bumps, package data (1) 1. preliminary data. symbol millimeters inches (2) 2. values in inches are converted from mm and rounded to 4 decimal digits. typ min max typ min max a 0.300 0.270 0.330 0.0118 0.0096 0.0140 a1 0.100 - - 0.0039 - - a2 0.200 - - 0.0079 - - b0.160--0.0063-- d 1.215 - 1.340 0.0478 - 0.0528 e 1.025 - 1.150 0.0404 - 0.0453 e 0.400 - - 0.0157 - - e1 0.693 - - 0.0273 - - e2 0.346 - - 0.0136 - - f 0.313 - - 0.0123 - - g 0.261 - - 0.0103 - - n (3) 3. n is the total number of terminals. 55 table 19. m24c16: wlcsp (0.5 mm height) 0.4 mm pitch, 5 bumps, package data (1) 1. preliminary data. symbol millimeters inches (2) 2. values in inches are converted from mm and rounded to 4 decimal digits. typ min max typ min max a 0.545 0.495 0.595 0.0215 0.0195 0.0234 a1 0.190 0.165 0.215 0.0075 0.0065 0.0085 a2 0.355 0.330 0.380 0.0140 0.0130 0.0150 b 0.270 0.240 0.300 0.0106 0.0094 0.0118 d 1.255 1.235 1.275 0.0494 0.0486 0.0502 e 1.210 1.190 1.230 0.0476 0.0469 0.0484 e 0.400 - - 0.0157 - - e1 0.693 - - 0.0273 - - e2 0.346 - - 0.0136 - - f 0.405 - - 0.0159 - - g 0.281 - - 0.0111 - - n (3) 3. n is the total number of terminals. 55
m24c16, m24c08, m24c04, m24c02, m24c01 package mechanical data doc id 5067 rev 17 29/38 figure 14. so8 narrow ? 8 lead plastic small outline, 150 mils body width, package outline 1. drawing is not to scale. 2. the ?1? that appears in the top view of the package show s the position of pin 1 and the ?n? indicates the total number of pins. table 20. so8 narrow ? 8 lead plastic small outline, 150 mils body width, package mechanical data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to 4 decimal digits. typ min max typ min max a - - 1.750 - - 0.0689 a1 - 0.100 0.250 - 0.0039 0.0098 a2 - 1.250 - - 0.0492 - b - 0.280 0.480 - 0.0110 0.0189 c - 0.170 0.230 - 0.0067 0.0091 ccc - - 0.100 - - 0.0039 d 4.900 4.800 5 0.1929 0.1890 0.1969 e 6.000 5.800 6.200 0.2362 0.2283 0.2441 e1 3.900 3.800 4.000 0.1535 0.1496 0.1575 e 1.270 - - 0.0500 - - h - 0.250 0.500 - 0.0098 0.0197 k-08-08 l - 0.400 1.270 - 0.0157 0.0500 l1 1.040 0.0409 so-a e1 8 ccc b e a d c 1 e h x 45? a2 k 0.25 mm l l1 a1 gauge plane
package mechanical data m24c16, m24c08, m24c04, m24c02, m24c01 30/38 doc id 5067 rev 17 figure 15. ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline 1. drawing is not to scale. 2. the central pad (the area e2 by d2 in the abov e illustration) is pulle d, internally, to v ss . it must not be allowed to be connected to any other voltage or sig nal line on the pcb, for example during the soldering process. 3. the circle in the top view of the package indicates the position of pin 1. table 21. ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to 4 decimal digits. note typ min max typ min max a 0.550 0.450 0.600 0.0217 0.0177 0.0236 a1 0.020 0.000 0.050 0.0008 0.0000 0.0020 b 0.250 0.200 0.300 0.0098 0.0079 0.0118 d 2.000 1.900 2.100 0.0787 0.0748 0.0827 d2 (mb) 1.600 1.500 1.700 0.0630 0.0591 0.0669 d2 (mc) - 1.200 1.600 - 0.0472 0.0630 e 3.000 2.900 3.100 0.1181 0.1142 0.1220 e2 (mb) 0.200 0.100 0.300 0.0079 0.0039 0.0118 e2 (mc) - 1.200 1.600 - 0.0472 0.0630 e 0.500 - - 0.0197 - - k - 0.300 - - 0.0118 - l - 0.300 0.500 - 0.0118 0.0197 l1 - 0.150 - - 0.0059 l3 - 0.300 - - 0.0118 - eee 0.080 0.0031 (2) 2. applied for exposed die paddle and terminals. excludes embedding par t of exposed die paddle from measuring. $ % :7?-%e ! ! eee , e b $ , % , , e b $ , % , 0in + + -" -#
m24c16, m24c08, m24c04, m24c02, m24c01 package mechanical data doc id 5067 rev 17 31/38 figure 16. tssop8 ? 8 lead thin shrink small outline, package outline 1. drawing is not to scale. 2. the circle in the top view of the package indicates the position of pin 1. table 22. tssop8 ? 8 lead thin shrink small outline, package mechanical data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to 4 decimal digits. typ. min. max. typ. min. max. a - - 1.200 - - 0.0472 a1 - 0.050 0.150 - 0.0020 0.0059 a2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b - 0.190 0.300 - 0.0075 0.0118 c - 0.090 0.200 - 0.0035 0.0079 cp - - 0.100 - - 0.0039 d 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 - - 0.0256 - - e 6.400 6.200 6.600 0.2520 0.2441 0.2598 e1 4.400 4.300 4.500 0.1732 0.1693 0.1772 l 0.600 0.450 0.750 0.0236 0.0177 0.0295 l1 1.000 - - 0.0394 - - -08-08 tssop8am 1 8 cp c l e e1 d a2 a e b 4 5 a1 l1
package mechanical data m24c16, m24c08, m24c04, m24c02, m24c01 32/38 doc id 5067 rev 17 figure 17. pdip8 ? 8 pin plastic dip, 0.25 mm lead frame, package outline 1. drawing is not to scale. table 23. pdip8 ? 8 pin plastic dip, 0.25 mm lead frame, package mechanical data symbol millimeters inches (1) 1. values in inches are converted from mm and rounded to 4 decimal digits. typ. min. max. typ. min. max. a - - 5.330 - - 0.2098 a1 - 0.380 - - 0.0150 - a2 3.300 2.920 4.950 0.1299 0.1150 0.1949 b 0.460 0.360 0.560 0.0181 0.0142 0.0220 b2 1.520 1.140 1.780 0.0598 0.0449 0.0701 c 0.250 0.200 0.360 0.0098 0.0079 0.0142 d 9.270 9.020 10.160 0.3650 0.3551 0.4000 e 7.870 7.620 8.260 0.3098 0.3000 0.3252 e1 6.350 6.100 7.110 0.2500 0.2402 0.2799 e 2.540 - - 0.1000 - - ea 7.600 - - 0.3000 - - eb - - 10.920 - - 0.4299 l 3.300 2.920 3.810 0.1299 0.1150 0.1500 pdip-b a2 a1 a l be d e1 8 1 c ea b2 eb e
m24c16, m24c08, m24c04, m24c02, m24c01 part numbering doc id 5067 rev 17 33/38 8 part numbering for a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest st sales office. table 24. ordering information scheme example: m24c16 ? w dw 3 t p /s device type m24 = i 2 c serial access eeprom device function 16 = 16 kbit (2048 x 8) 08 = 8 kbit (1024 x 8) 04 = 4 kbit (512 x 8) 02 = 2 kbit (256 x 8) 01 = 1 kbit (128 x 8) operating voltage w = v cc = 2.5 v to 5.5 v (400 khz) r = v cc = 1.8 v to 5.5 v (400 khz) f = v cc = 1.7 v to 5.5 v (400 khz) package bn = pdip8 mn = so8 (150 mil width) mb or mc= ufdfpn8 (mlp8) dw = tssop8 (169 mil width) cs = wlcsp (1) (chip scale package) 1. only m24c08 and m24c16 devices are offered in the wlcsp package. ct = thin wlcsp (2) (chip scale package) 2. only m24c08-f devices are offered in the thin wlcsp package. device grade 6 = industrial: device tested with standard test flow over ?40 to 85 c 3 = automotive: device tested with high reliability certified flow (3) over ?40 to 125 c 3. st strongly recommends the use of the automotive grade devices for use in an automotive environment. the high reliability certified flow (hrcf) is des cribed in the quality note qnee9801. please ask your nearest st sales office for a copy. 5 = consumer: device tested with standard test flow over ?20 to 85 c. option t = tape and reel packing plating technology p or g = ecopack ? (rohs compliant) process (4) 4. used only for device grade 3. /s = f6sp36%
revision history m24c16, m24c08, m24c04, m24c02, m24c01 34/38 doc id 5067 rev 17 9 revision history table 25. document revision history date version changes 10-dec-1999 2.4 tssop8 turned-die package removed (p 2 and order information) lead temperature added for tssop8 in table 2 18-apr-2000 2.5 labelling change to fig-2d, correction of values for ?e? and main caption for tab-13 05-may-2000 2.6 extra labelling to fig-2d 23-nov-2000 3.0 sbga package information removed to an annex document -r range changed to being the -s range, and the new -r range added 19-feb-2001 3.1 sbga package information put back in this document lead soldering temperature in the absolute maximum ratings table amended write cycle polling flow chart using ack illustration updated references to psdip changed to pdip and package mechanical data updated wording brought in to line with standard glossary 20-apr-2001 3.2 revision of dc and ac characteristics for the -s series 08-oct-2001 3.3 ball numbers added to the sbga connections and package mechanical illustrations 09-nov-2001 3.4 specification of test condition for leakage currents in the dc characteristics table improved 30-jul-2002 3.5 document reformatted using new template. sbga5 package removed tssop8 (3x3mm2 body size) package (msop8) added. -l voltage range added 04-feb-2003 3.6 document title spelt out more full y. ?w?-marked devices with tw=5ms added. 05-may-2003 3.7 -r voltage range upgraded to 400khz working, and no longer preliminary data. 5v voltage range at temperature range 3 (-xx3) no longer preliminary data. -s voltage range removed. -wxx3 voltage+temp ranged added as preliminary data. 07-oct-2003 4.0 table of contents, and pb-free options added. minor wording changes in summary description, power-on re set, memory addressing, read operations. v il (min) improved to -0.45v. t w (max) value for -r voltage range corrected. 17-mar-2004 5.0 mlp package added. absolute maximum ratings for v io (min) and v cc (min) changed. soldering temperature information clarified for rohs compliant devices. device grade information clarified. process identification letter ?g? information added. 2.2-5.5v range is removed, and 4.5-5.5v range is now not for new design
m24c16, m24c08, m24c04, m24c02, m24c01 revision history doc id 5067 rev 17 35/38 7-oct-2005 6.0 product list summary table added. aec-q100-002 compliance. device grade information clarified. updated device internal reset section, figure 4 , figure 5 , ta b l e 1 6 and table 24 added ecopack? information. updated tw=5ms for the m24cxx-w. 17-jan-2006 7.0 pin numbers removed from silhouettes (see on page 1). internal device reset paragraph moved to below section 2.4: supply voltage (vcc) . section 2.4: supply voltage (vcc) added below section 2: signal description . test conditions for v ol updated in ta b l e 9 and ta b l e 1 0 so8n package specifications updated (see table 20 ) new definition of i cc1 over the whole v cc range (see tables 9 , 10 and 11 ). 19-sep-2006 8 document converted to new st template. so8 and ufdfpn8 package spec ifications updated (see section 7: package mechanical data ). section 2.4: supply voltage (vcc) clarified. i li value given with the device in standby mode in tables 9 , 10 and 11 . information given in table 16: ac characteristics (m24cxx-r and m24cxx- f) are no longer preliminary data. 03-aug-2007 9 1.7 v to 5.5 v v cc voltage range added (m24c16-f, m24c08-f, m24c04-f part numbers added; ta b l e 8 and table 12 added). section 2.4: supply voltage (vcc) modified. note 1 updated to latest standard revision in table 5: absolute maximum ratings . rise/fall time conditions for i cc modified in ta bl e 9 , ta b l e 1 0 and table 11 . i cc1 conditions modified in table 11: dc characteristics (m24cxx-r) . note removed below table 14: input parameters . t w modified for m24cxx-r in ta b l e 1 6 , note added. tssop8 (ds) package spec ifications updated (see ta bl e 2 3 and figure 17 ). added: ta b l e 2 5 , table 26 , ta bl e 2 7 , ta bl e 2 8 and ta bl e 2 9 summarizing all available products. table 24: ordering information scheme : blank option removed under plating technology, /w removed under process. 27-sep-2007 10 section 2.3: chip enable (e0, e1, e2) updated. concerned signals specified for v il and v ih parameters, and note removed in dc characteristics tables ( ta bl e 9 , ta bl e 1 0 , ta b l e 1 1 and table 12 ). t w modified in table 16: ac characteristics (m24cxx-r and m24cxx-f) . m24c08-f and m24c04-f offered in ufdfpn8 package in the temperature range 5 (see ta bl e 2 6 and ta bl e 2 7 ). date version changes
revision history m24c16, m24c08, m24c04, m24c02, m24c01 36/38 doc id 5067 rev 17 30-jan-2009 11 section 2.4: supply voltage (vcc) clarified. figure 5: maximum rp value versus bus parasitic capacitance (c) for an i2c bus updated. i ol added to table 5: absolute maximum ratings . icc1 test conditions clarified in dc characteristics ta bl e 9 , table 10 , ta bl e 1 1 and ta bl e 1 2 . note modified below table 14: input parameters . t xh1xh2 and t xl1xl2 added to table 15: ac characteristics at 400 khz (i2c fast-mode) (m24cxx-w, m24cxx-r, m24cxx-f) , note 4 removed. figure 12: ac waveforms updated. wlcsp package added (refer to figure 3 and section 7: package mechanical data ). in section 7: package mechanical data : ? ecopack text added ? inch values calculated from millim eters and rounded to four decimal digits ? ufdfpn package specifications updated small text changes. 11-mar-2009 12 timings for 100 khz i 2 c standard-mode added (see table 16: ac characteristics at 100 khz (i2c standard-mode) (m24cxx-w, m24cxx-r, m24cxx-f) . 28-may-2009 13 added thin wlcsp package. added table 19: m24c16: wlcsp (0.5 mm height) 0.4 mm pitch, 5 bumps, package data . updated available devices in table 25 , ta b l e 2 6 , ta b l e 2 7 , table 28 , and ta b l e 2 9 . 02-mar-2010 14 package ecopack1 or ecopack2 category specified. section 3.1: start condition and section 3.6: write operations updated. i lo test conditions modified in table 9: dc characteristics (m24cxx-w, device grade 6) , table 10: dc characteristics (m24cxx-w, device grade 3) and table 11: dc characteristics (m24cxx-r) . table 15: ac characteristics at 40 0 khz (i2c fast-mode) (m24cxx-w, m24cxx-r, m24cxx-f) modified. t dl1dl2 renamed as t ql1ql2 in table 16: ac characteristics at 100 khz (i2c standard-mode) (m24cxx-w, m24cxx-r, m24cxx-f) . figure 12: ac waveforms updated. 01-apr-2010 15 updated figure 15: ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline and table 21 on page 30 . updated table 13: ac measurement conditions . updated ta bl e 2 5 to ta b l e 2 7 . date version changes
m24c16, m24c08, m24c04, m24c02, m24c01 revision history doc id 5067 rev 17 37/38 29-apr-2010 16 deleted tssop8 3x3 mm package from cover page. deleted figure and table relating to tssop8 3x3 mm package information. deleted line and note in table 24: ordering information scheme concerning tssop8 3x3 mm package. in table 26: available m24c08 products (package, voltage range, temperature grade) updated ufdfpn8 (mc) package for m24c08-f range to 5 and deleted line concerning tssop8 3x3 mm package. in table 27: available m24c04 products (package, voltage range, temperature grade) updated ufdfpn8 (mc) package for m24c08-f range to 5. in table 28: available m24c02 products (package, voltage range, temperature grade) updated ufdrpn8 options to mb or mc. 15-apr-2011 17 updated: - text modified in section 2.3: chip enable (e0, e1, e2) . - text modified in section 3.6: write operations . - v esd minimum value deleted of table 5: absolute maximum ratings . - figure 15: ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, outline . - e2 (rev mc): ?ddd? has been changed to ?eee? and its values modified in table 21: ufdfpn8 (mlp8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm, data . added: - note at the end of the section 1: description . - figure footnote below the figure 3: wlcsp and thin wlcsp connections (top view, marking side, with balls on the underside) . date version changes
m24c16, m24c08, m24c04, m24c02, m24c01 38/38 doc id 5067 rev 17 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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